All Products 
Latest News | Power supply | AC 220V 50Hz;1200W |
| Sample Size range | ≤8inch |
| Luminous size | 200*200mm |
| Lamp wavelength | 365nm |
| Irradiation height | 50-150mm |
| Cooling method | Water cooling |
| Dimension | 575*350*241mm |
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The UV-801 debonding machine is a cutting and debonding equipment specifically designed for products such as wafers, QFN, glass, substrates, mobile phone modules, and ceramics that are glued with UV film.
Products Description
| Power supply | AC 220V 50Hz;1200W |
| Sample Size range | ≤8inch |
| Luminous size | 200*200mm |
| Lamp wavelength | 365nm |
| Irradiation height | 50-150mm |
| Cooling method | Water cooling |
| Dimension | 575*350*241mm |
